Complex of deposition, drying and manifestation of resists

Installation for processing plates in vapors of hexamethyldisilazane

 

The installation is intended for preliminary preparation of the plate surface before applying a photoresist (dehydration and treatment in hexamethyldisilazane vapors). Provides high uniformity and stability of heating.

Key features and capabilities:

  • size of substrates: diameter from 1 to 200 mm, square 8”x 8”;
  • temperature range: from room to 300°C; accuracy of temperature maintenance: 0.1°C;
  • uniformity of temperature on the surface of the heating plate: 0.3%;
  • three drying methods: contact, vacuum and with micro-clearance.

Photoresist Application Unit

The installation is designed for applying electron and photoresists by centrifugation and drying on a hot plate. Equipped with a syringe dosing system of the resist, edge cleaning systems from above and below.

Key features and capabilities:

  • size of substrates: from 1 to 200 mm, square 7”x 7”;
  • centrifugation speed up to 12000 rpm, accuracy of setting the speed 0.2 rpm;

  • centrifuge acceleration up to 30000 rpm / s without load, up to 23000 rpm / s with a substrate of 200 mm;
  • temperature range: from room to 300°C; accuracy of temperature maintenance: 0.1°C;
  • uniformity of temperature on the surface of the heating plate: 0.3%;
  • three drying methods: contact, vacuum and with micro-clearance (programmable loading pins);
  • the ability to work both with plates and with photo masks.

Photoresist Drying Unit

The unit is designed for heat treatment of plates at different stages of the formation of a photoresist mask (post-exposure heat treatment, drying, tanning).

Key features and capabilities:

  • substrate size: diameter from 3 mm to 200 mm, square 8”x 8”;
  • temperature range: from room to 400°C; accuracy of temperature maintenance: 0.1°C;
  • uniformity of temperature on the surface of the heating plate: 0.3%;
  • the ability to control the rate of heating and drying of the substrates in an inert medium.

Plate Cooling Unit

The installation is intended for cooling substrates after temperature treatments at various stages of the formation of a photoresist mask.

Key features and capabilities:

  • size of substrates: diameter from 1 to 200 mm, square 8” x 8”;
  • temperature range from 15°C to room temperature, accuracy of temperature maintenance: 0.1°C;
  • uniformity of temperature on the surface of the heating plate: 0.3%;
  • the possibility of cooling in contact with a gap in a vacuum contact.

Setting the manifestation of photoresist

The installation is intended for the manifestation of electron and photoresists after exposure, as well as for the lift-off process (explosive lithography).

Key features and capabilities:

  • size of substrates: from 1 to 200 mm, square 7” x 7”;
  • centrifugation speed up to 12000 rpm, accuracy of setting the speed 0.2 rpm;
  • centrifuge acceleration up to 30000 rpm / s without load, up to 23000 rpm / s with a substrate of 200 mm;
  • 5 developer feed channels;
  • the possibility of spray and jet manifestations.

News