Thermal Processes Unit

Bonding (splicing) installation

The unit is designed for splicing plates by anodic, thermocompression, polymer, adhesive bonding, eutectic and frits.

Key features and capabilities:

• splicing of plates (silicon and glass) with dimensions of 200 mm, 150 mm, 100 mm, as well as pieces of plates with a maximum linear size of up to 76 mm;
• compatibility with the installation of alignment and exposure for automatic processing of pre-aligned and fixed relative to each other plates;
• crevice feed of the plates, ensuring the purity of the process of splicing;
• glued system thickness - 6 mm;
• the number of plates in one load - 2;
• vacuum in the bonding chamber - 5 * 10-5 mbar;
• types of gases for pumping - inert gases and air;
• maximum temperature inside the chamber - 500 оС;
• temperature uniformity - ± 3%;
• temperature repeatability - ± 3%;
• temperature stability - ± 2%;
• maximum voltage during bonding - 2 kV;
• maximum bonding current strength - 60 mA;
• maximum bonding force - 20 kN;
• the presence of an autoloader for feeding pre-aligned plates into the splicing chamber.