Particle Laser Analysis Systems

Laser reflectometer

The device is intended for mapping, determining the number, position, and size of light-scattering defects (dust particles, scratches, spots) on the surface of semiconductor wafers, studying the microroughness of the wafer surface, as well as conducting input and output quality control of the wafers.

Key features and capabilities:

• light source: laser with a wavelength of 405 nm;
• diameter of detected defects: 100 nm;
• substrate diameter: 76, 100, 125, 150, 200 mm;
• standard deviation (with an average number of particles of 500 pieces): less than 5%;
• productivity (diameter 150 mm): 30 plates / hour.

Bluewave Laser Particle Size Analyzer

The device is designed to determine the size distribution of particles in suspensions, emulsions, powders using the laser diffraction method.

Key features and capabilities:

• diagnosed size range - from 0.01 to 2816 microns;
• analysis of liquid and bulk (size from 0.25 microns) samples;
• three lasers: 780 nm (one laser) and 405 nm (two lasers), rated power - 3 mV;
• measurement time - from 10 s to 1 min;
• two multichannel detector blocks with a logarithmic distribution of photosensitive elements;
• recorded scattering angles - from 0.02 to 163 degrees;
• computational algorithms (based on Mi solutions), including those with correction for non-spherical form factors.